Electronics PCB Customized PCB Assembly
Port:
Shenzhen, China
Production Capacity:
10000 Square Meter
Payment Terms:
L/C, T/T, Paypal
SHENZHEN HYY TECHNOLOGY CO., LTD.
Guangdong, China
Last Login Date:
May 28, 2020
Business Type:
Manufacturer/Factory
Main Products:
PCB, PCB Board, Aluminum PCB, Fr-4 PCB, Single-Sided PCB, LED PCB, Lead Free/ Hal PCB, OSP PCB, PCB Assemblies, LED PCB Board
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Product Description
Company Info
Basic Info.
Model NO.
HYY-121003
Type
Rigid Circuit Board
Flame Retardant Properties
Dielectric
Aluminum Base Board
Base Material
Insulation Materials
Metal Composite Materials
Processing Technology
Application
Mechanical Rigid
Material
Brand
Hyy
Specail Hole
No
Trademark
HYY
Transport Package
Vacuum Package
Specification
UL, SGS, ISO14001, ISO9001
Origin
Made in China
HS Code
85340090
Product Description
Electronics PCB Customized PCB Assembly
Material: Aluminum Based
Brand: Polytronics Ventec TOTKING Boyu Bergquist
Thickness: 0.2-5.0 mm
Copper: 1oz-5oz
Thermal conductivity: 1-8 W
Solder resist: TAIYO ink
Max PCB size: 600mm*1200mm
Surface treatment: HASL,immersion gold,OSP
Minimum Hole Size: 0.2mm (+/-0.1mm)
Certifition:
Details:
Factory Manufacture Capability:
Material: Aluminum Based
Brand: Polytronics Ventec TOTKING Boyu Bergquist
Thickness: 0.2-5.0 mm
Copper: 1oz-5oz
Thermal conductivity: 1-8 W
Solder resist: TAIYO ink
Max PCB size: 600mm*1200mm
Surface treatment: HASL,immersion gold,OSP
Minimum Hole Size: 0.2mm (+/-0.1mm)
Certifition:
Details:
Factory Manufacture Capability:
Factory Manufacture Capability | ||
NO | ITEM | Techinical capabilities |
1 | Materials | FR-4, CEM-3, Al Base, Cooper Base. |
2 | Material Type | TOTKING T111, EASTPOWER EPA-M0 |
3 | Layers | 1 Layer |
4 | Min. core material | PP |
5 | Max. board size | 600mm *1200mm |
6 | Copper Thickness | 1-4 OZ |
7 | Min. board thickness | 0.5 mm |
8 | Max. board thickness | 5.0 mm |
9 | Min. line width/space | 0.1mm |
10 | Min. Letter line width | 0.15mm |
11 | Min. Letter height | 0.8mm |
12 | Min. hole size | 0.75mm(NPTH) |
13 | Hole dia. tolerance | ±0.05mm |
14 | solder Mask | White, Black, Green |
15 | Outline Tolerance | ±0.15mm |
16 | Modeling | Punching, Routing, V-cutting |
17 | Special Hole | Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole |
18 | Peel Strength | >=1.3N/mm |
19 | Thermal Stress | 288ºC, 2min |
20 | Thermal Conductivity | >=2.0 W/m-k |
21 | Thermal Resistance | ≤0.55 ºC/W |
22 | Test Voltage | 5 V |
23 | Surface Finish | HAL , OSP , Immersion Gold |
24 | File Format | Gerber , DPF, HPGL,CAM,DXP,CADM,PADS |
25 | Dielectric Breakdown | >=2.5 KV |
26 | Max. Package Size | 1200mm*600 mm |
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