LED PCB Factory From Shenzhen
Port:
Shenzhen, China
Production Capacity:
10000 Square Meter
Payment Terms:
L/C, T/T, Paypal
SHENZHEN HYY TECHNOLOGY CO., LTD.
Guangdong, China
Last Login Date:
May 28, 2020
Business Type:
Manufacturer/Factory
Main Products:
PCB, PCB Board, Aluminum PCB, Fr-4 PCB, Single-Sided PCB, LED PCB, Lead Free/ Hal PCB, OSP PCB, PCB Assemblies, LED PCB Board
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Product Description
Company Info
Basic Info.
Model NO.
HYY-0128
Type
Rigid Circuit Board
Flame Retardant Properties
Dielectric
Aluminum Base Board
Base Material
Insulation Materials
Metal Composite Materials
Processing Technology
Application
Mechanical Rigid
Material
Brand
Hyy
Specail Hole
No
Trademark
HYY
Transport Package
Vacuum Package
Specification
UL, SGS, ISO14001, ISO9001
Origin
Made in China
HS Code
85340090
Product Description
LED PCB Factory From Shenzhen
Product Description:
UL Approved PCB board
Board material: Aluminum
Board thickness:1.0 mm
Copper thickness:1oz
Thermal conductivity: 4.0W/MK
Withstanding voltage:2000V
Solder resist:White
Surface finishing: HASL
Special drill hole: NO
Partners:
Details:
Factory Manufacture Capability:
Product Description:
UL Approved PCB board
Board material: Aluminum
Board thickness:1.0 mm
Copper thickness:1oz
Thermal conductivity: 4.0W/MK
Withstanding voltage:2000V
Solder resist:White
Surface finishing: HASL
Special drill hole: NO
Partners:
Details:
Factory Manufacture Capability:
Factory Manufacture Capability | ||
NO | ITEM | Techinical capabilities |
1 | Materials | FR-4, CEM-3, Al Base, Cooper Base. |
2 | Material Type | TOTKING T111, EASTPOWER EPA-M0 |
3 | Layers | 1 Layer |
4 | Min. core material | PP |
5 | Max. board size | 600mm *1200mm |
6 | Copper Thickness | 1-4 OZ |
7 | Min. board thickness | 0.5 mm |
8 | Max. board thickness | 5.0 mm |
9 | Min. line width/space | 0.1mm |
10 | Min. Letter line width | 0.15mm |
11 | Min. Letter height | 0.8mm |
12 | Min. hole size | 0.75mm(NPTH) |
13 | Hole dia. tolerance | ±0.05mm |
14 | solder Mask | White, Black, Green |
15 | Outline Tolerance | ±0.15mm |
16 | Modeling | Punching, Routing, V-cutting |
17 | Special Hole | Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole |
18 | Peel Strength | >=1.3N/mm |
19 | Thermal Stress | 288ºC, 2min |
20 | Thermal Conductivity | >=2.0 W/m-k |
21 | Thermal Resistance | ≤0.55 ºC/W |
22 | Test Voltage | 5 V |
23 | Surface Finish | HAL , OSP , Immersion Gold |
24 | File Format | Gerber , DPF, HPGL,CAM,DXP,CADM,PADS |
25 | Dielectric Breakdown | >=2.5 KV |
26 | Max. Package Size | 1200mm*600 mm |
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