HDI/Multi-Layer/BGA Printed Circuit Board PCB

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HDI/Multi-Layer/BGA Printed Circuit Board PCB

Basic Info

Product Description

  • Model NO.: HYY-0134
  • Flame Retardant Properties: V0
  • Base Material: Aluminum Base Board
  • Processing Technology: Electrolytic Foil
  • Mechanical Rigid: Rigid
  • Brand: Hyy
  • Board Thickness: 0.5-5.0mm
  • Max. Board Thickness: 5.0 mm
  • Min. Letter Line Width: 0.15mm
  • Specification: UL, SGS, ISO14001, ISO9001
  • HS Code: 85340090
  • Type: Rigid Circuit Board
  • Dielectric: Aluminum Base Board
  • Insulation Materials: Metal Composite Materials
  • Application: Consumer Electronics
  • Material: Aluminum Base Board
  • Copper Thickness: 1-5 Oz
  • Layers: 1-16 Layers
  • Min. Line Width/Space: 0.1mm
  • Trademark: HYY
  • Origin: Made in China

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